Model: FPC-1120 Thickness: 20μm
1. High sensitivity helps to improve production efficiency.
2. Fine film removal, suitable for the production of high-density circuit boards.
3. with excellent adhesiveness and resolution, can be used in high-density PCBs.
Model |
FPC-1120 |
||
Usage |
etching |
||
recommended ST range |
18 |
||
recommended exposure (parallel beam) |
ST=16/41 |
30 |
|
ST=18/41 |
40 |
||
ST=20/41 |
50 |
||
recommended concentration of Na2CO3(wt%) |
1.0 +0.2/-0.1 |
||
temperature(℃) |
30±2 |
||
minimum development time(seconds) |
13 |
||
adhesiveness(μm) |
ST=16/41 |
20 |
|
ST=18/41 |
18 |
||
ST=20/41 |
18 |
||
resolution (μm) |
ST=16/41 |
18 |
|
ST=18/41 |
20 |
||
ST=20/41 |
22 |
||
recommended concentration of Na2CO3(wt%) |
3.0±0.5 |
||
temperature(℃) |
50±5 |
||
minimum defilming time(second) |
17 |