Model: FPC-1120 Thickness: 20μm
1. High sensitivity helps to improve production efficiency.
2. Fine film removal, suitable for the production of high-density circuit boards.
3. with excellent adhesiveness and resolution, can be used in high-density PCBs.
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Model |
FPC-1120 |
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Usage |
etching |
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recommended ST range |
18 |
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recommended exposure (parallel beam) |
ST=16/41 |
30 |
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ST=18/41 |
40 |
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ST=20/41 |
50 |
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recommended concentration of Na2CO3(wt%) |
1.0 +0.2/-0.1 |
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temperature(℃) |
30±2 |
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minimum development time(seconds) |
13 |
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adhesiveness(μm) |
ST=16/41 |
20 |
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ST=18/41 |
18 |
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ST=20/41 |
18 |
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resolution (μm) |
ST=16/41 |
18 |
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ST=18/41 |
20 |
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ST=20/41 |
22 |
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recommended concentration of Na2CO3(wt%) |
3.0±0.5 |
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temperature(℃) |
50±5 |
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minimum defilming time(second) |
17 |
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